Sensor based on smart response of two-dimensional nanomaterial and associated method

ABSTRACT

Aspects of the subject disclosure may include, for example, a process in which a first two-dimensional layer is applied to a substrate that includes all or a portion of an antenna mount. A second two-dimensional layer is applied to the first two-dimensional layer forming a bi-layer element having an axis. An initial electrical resistance exists across the bi-layer element and along its axis, wherein a first change to the substrate results in a second change to the bi-layer element such that the initial electrical resistance is replaced by a lower electrical resistance. Other embodiments are disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/403,196, filed on May 3, 2019. All sections of the aforementionedapplication(s) and/or patent(s) are incorporated herein by reference intheir entirety.

FIELD OF THE DISCLOSURE

The subject disclosure relates to a sensor based on a smart response ofa two-dimensional nanomaterial and an associated method. In one example,provided is a tunable sensor (and associated method) for detection ofsubstrate change (e.g., damage) based on a smart response of atwo-dimensional nanomaterial coating.

BACKGROUND

Two-dimensional materials are a special group of nanomaterials that, dueto atomic thickness, have very different properties from bulk materials.An example of such a two-dimensional material is graphene, a single-atomlayer of carbon, forming a hexagonal lattice. The two-dimensional aspectof various two-dimensional materials leads to tunable electronic andmechanical properties (which differ from properties associated with bulkmaterials). Since the surface of a two-dimensional material dominatesmaterial properties, changes at the surface can lead to dramatic changesof, for example, mechanical stiffness and/or electrical conductivity.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference will now be made to the accompanying drawings, which are notnecessarily drawn to scale, and wherein:

FIG. 1A is a diagram illustrating an example, non-limiting embodiment ofa sensor 100 formed of one coating 102 (comprising Mo atoms and Seatoms) and another coating 104 (comprising Mo atoms and S atoms) inaccordance with various aspects described herein (in this figure, asubstrate is not shown). This FIG. 1A shows initial removal of atoms toprepare material for stress-induced response. As seen in this example,two Se vacancies 110, 111 and two S vacancies 121, 122 are created atthe manufacture stage.

FIG. 1B is a diagram illustrating an example, non-limiting embodiment ofsensor 100 (of FIG. 1A) in accordance with various aspects describedherein (in this figure, a substrate is again not shown). This FIG. 1Bshows stress-induced atom migration, leading to creation of vacanciesand formation of metallic islands due to high vacancy concentrations. Asseen in this example, during operation a vacancy creation process hasresulted in there now being five Se vacancies 110, 111, 112, 113, 114and five S vacancies 121, 122, 123, 124, 125. In this figure, aMolybdenum Metallic Region is indicated by the area within the dashedrectangle.

FIGS. 2A and 2B are diagrams illustrating an example, non-limitingembodiment of a sensor 202 formed on a substrate 204 (e.g., monitoredmaterial) in accordance with various aspects described herein. FIG. 2Ais a top view. FIG. 2B is a cross-sectional view that shows across-section (the cross-section is taken along the horizontal lineshown in FIG. 2A; the horizontal line is an imaginary line and does notrepresent a feature or element of the sensor).

FIGS. 2C and 2D are diagrams illustrating an example, non-limitingembodiment of a sensor formed on a substrate. FIG. 2C is a top view andFIG. 2D is a side view.

FIGS. 2E and 2F are diagrams illustrating an example, non-limitingembodiment of a sensor formed on a substrate. FIG. 2E is a top view andFIG. 2F is a side view.

FIGS. 2G and 2H are diagrams illustrating an example, non-limitingembodiment of a sensor formed on a substrate. FIG. 2G is a top view andFIG. 2H is a side view.

FIGS. 2I and 2J are diagrams illustrating an example, non-limitingembodiment of a sensor formed on a substrate. FIG. 2I is a top view andFIG. 2J is a side view.

FIG. 3 depicts an illustrative embodiment of a method in accordance withvarious aspects described herein.

FIG. 4 is a block diagram of an example, non-limiting embodiment of acomputing environment in accordance with various aspects describedherein.

DETAILED DESCRIPTION

The subject disclosure describes, among other things, illustrativeembodiments for a sensor (and associated method) configured to detectsubstrate change (e.g., damage) based on a response of a two-dimensionalcoating. Other embodiments are described in the subject disclosure.

As described herein, various embodiments provide for interfacing atwo-dimensional material with a substrate (e.g., a surface of a cellphone tower element) in order to provide in-situ observation ofstructural integrity of the substrate (e.g., the cell phone towerelement).

At a manufacturing stage, a two-dimensional material can be constructedto be sensitive to particular mechanical deformations by implantingdefects, as shown in FIG. 1A. The defects can be activated as describedherein by (for example) external physical stress, electromagneticradiation and/or temperature changes. FIG. 1B shows activation andmovement of the defects (subsequent to the implantation of the defectsas shown in FIG. 1A) due to changes in a structure of material (such asa substrate with which a sensor interfaces). The motion of defectschanges electronic properties of the two-dimensional material, causing aformation of one or more electrical conducting paths (shown, forexample, in FIGS. 2A, 2B). The one or more electrical conducting pathscan be, for example, between a left side of the sensor shown in FIGS.2A, 2B and a right side of the sensor shown in FIGS. 2A, 2B. Thepresence of the electrical conductive path(s) can be ascertained (suchas by monitoring resistance and/or conductivity across the sensor fromthe left side of the sensor shown in FIGS. 2A, 2B to the right side ofthe sensor shown in FIGS. 2A, 2B. The presence of the electricalconductive path(s) can be used as a trigger to activate a signal (e.g.,a visual signal and/or an audio signal). In one example, this signal canwarn of a particular wear-and-tear of the observed substrate (e.g.,element of a cell phone tower). In another example, this signal can warnof a catastrophic failure of the observed substrate (e.g., element of acell phone tower).

In one specific example, provided is an initially insulatingtwo-dimensional MoS₂/MoSe₂ bilayer, which has a small bandgap of ˜1 eV,with a concentration of Se and S vacancies. Applying stress to suchmaterial (thereby straining the material) will cause vacancies tosegregate at the interface, leaving (in this example) a metallic Mo-richregion, shown in the dashed box in FIG. 1B. This metallic region forms apath to signal microscopic fractures (such as, for example, as precursorof catastrophic failure). In one specific example, the substrate that ismonitored by the sensor is a structurally important cell phone towerelement.

In one embodiment, a method comprises applying to a substrate (such as,for example, a leg of a cell phone tower, a supporting structure on acell phone tower, an antenna mount) a first coating that istwo-dimensional (e.g., on the order of one or a fewatomic-layers-thick); applying to the first coating a second coatingthat is two-dimensional (e.g., on the order of one or a fewatomic-layers-thick); wherein the first coating and the second coatingform a sensor (which, given the thinness of the first and secondcoatings, is in aggregate still considered two-dimensional with, forexample, a thickness of less than ten lattice constants). In oneexample, the sensor has a first dimension along a first axis (e.g.,length) and a second dimension along a second axis (e.g., width). Therecan be an initial electrical resistance across the sensor along thefirst axis. A detection can be made (e.g., by a processing systemincluding a processor) of a presence of a new electrical resistanceacross the sensor along the first axis (wherein the new electricalresistance is caused by a change to the substrate). In one specificexample, the change to the substrate is a mechanical change. In anotherspecific example, the mechanical change is a crack, a fracture and/or astrain in the substrate. In another specific example, the change to thesubstrate is caused by mechanical stress, a temperature change, ahumidity change, a change in incident light, or any combination thereof.

In one example, the first coating can be deposited by film deposition.In another example, the second coating can be deposited by filmdeposition. In another example, each of the first coating and the secondcoating can be deposited by film deposition.

In one example, the MoS₂ layer is deposited on a substrate and then theMoSe₂ layer is deposited on the MoS₂ layer. In another example, theMoSe₂ layer is deposited on a substrate and then the MoS₂ layer isdeposited on the MoSe₂ layer.

FIGS. 2A and 2B are diagrams illustrating an example, non-limitingembodiment of a sensor 202 formed on a substrate 204 (e.g., monitoredmaterial) in accordance with various aspects described herein. FIG. 2Ais a top view. FIG. 2B is a cross-sectional view that shows across-section (the cross-section is taken along the horizontal lineshown in FIG. 2A; the horizontal line is an imaginary line and does notrepresent a feature or element of the sensor). In these FIGS. 2A and 2B,there has been formation of metallic paths (through the sensor) in areasabove the substrate 204 that are under stress. These metallic paths areshown (in the top view of FIG. 2A) as curved lines in the sensor 202 andare shown (in the cross-section of FIG. 2B) as corresponding verticallines in the sensor 202. As seen in FIG. 2A, these metallic paths spanacross the sensor 202 to reach contacts (not shown) on each side of thesensor 202. As seen in FIG. 2B, damage in the substrate (see thevertical lines) induces a corresponding change in the two-dimensionalmaterial of the sensor, leading to formation of metallic islands in thetwo-dimensional material.

Referring now to FIGS. 2C and 2D, these are diagrams illustrating anexample, non-limiting embodiment of a sensor (including surface 252)formed on a substrate 258. Electrical contacts 254,256 are in electricalcommunication with surface 252. FIG. 2C is a top view and FIG. 2D is aside view.

Referring now to FIGS. 2E and 2F, these are diagrams illustrating anexample, non-limiting embodiment of a sensor (including surface 262)formed on a substrate 268. Electrical contacts 264,266 are in electricalcommunication with surface 262. FIG. 2E is a top view and FIG. 2F is aside view.

Referring now to FIGS. 2G and 2H, these are diagrams illustrating anexample, non-limiting embodiment of a sensor (including surface 272)formed on a substrate 278. Electrical contacts 274,276 are in electricalcommunication with surface 272. FIG. 2G is a top view and FIG. 2H is aside view.

Referring now to FIGS. 2I and 2J, these are diagrams illustrating anexample, non-limiting embodiment of a sensor (including surface 282)formed on a substrate 288. Electrical contacts 284,286 are in electricalcommunication with surface 282. FIG. 2I is a top view and FIG. 2J is aside view.

As described herein, the sensor (e.g., comprising a firsttwo-dimensional coating and a second two-dimensional coating) can beapplied to a substrate having a flat or otherwise contoured surface(e.g., curved surface, wavy surface).

As described herein, the sensor (e.g., comprising a firsttwo-dimensional coating and a second two-dimensional coating) can beapplied to a substrate in such a manner that the sensor has (as seen ina top view) any desired shape.

Referring now to FIG. 3, various steps of a method 300 according to anembodiment are shown. As seen in this FIG. 3, step 302 comprisesapplying to a substrate a first two-dimensional layer. Next, step 304comprises applying to the first two-dimensional layer a secondtwo-dimensional layer, wherein the first two-dimensional layer and thesecond two-dimensional layer form a bi-layer element, wherein thebi-layer element has an axis, wherein there is an initial electricalresistance across the bi-layer element along the axis, and wherein afirst change to the substrate results in a second change to the bi-layerelement such that the initial electrical resistance is replaced by alower electrical resistance. Next, step 306 comprises applying first andsecond electrical contacts to the bi-layer element. Next, step 308comprises detecting, via use of the first and second electricalcontacts, that the initial electrical resistance has been replaced bythe lower electrical resistance.

In one embodiment, the first two-dimensional layer is a first coatingthat is applied to the substrate by a first film deposition. In anotherembodiment, the second two-dimensional layer is a second coating that isapplied to the first coating by a second film deposition.

While for purposes of simplicity of explanation, the respectiveprocesses are shown and described as a series of blocks in FIG. 3, it isto be understood and appreciated that the claimed subject matter is notlimited by the order of the blocks, as some blocks may occur indifferent orders and/or concurrently with other blocks from what isdepicted and described herein. Moreover, not all illustrated blocks maybe required to implement the methods described herein.

As described herein, various embodiments can be applied in the contextof consumer, commercial, and/or government agency devices and systems.

As described herein, various embodiments provide for constructing one ormore sensors (e.g., one or more sensors for detecting damage or otherchanges to a substrate).

As described herein, various embodiments provide for using one or moresensors (e.g., using one or more sensors for detecting damage or otherchanges to a substrate).

In various examples the substrate (e.g., monitored material) can be anymaterial or structure whose state or condition it is desired to bemonitored.

Reduction of manufacturing costs for nanomaterials facilitatesdevelopment of “smart materials” and their application to change thelandscape of how various items are made. As described herein,flexibility and tunability of nanomaterial properties can be used toengineer a response to environmental conditions, such as electromagneticradiation, temperature and humidity. In various examples, this responsecan be pre-trained at the manufacturing stage and used to monitorspecific changes in integrity of various structures. In variousexamples, immediate damage and/or wear-and-tear over time are reflectedin microscopic deformations, which trigger a pre-defined response innanomaterials, followed by one or more “smart responses”.

In various embodiments, mechanisms are provided to use trending topredict the likelihood of an upcoming structural failure (or otherdamage).

In various embodiments, provided is an approach that is functionallyproactive in that it can be able to detect problems (e.g., materialimperfections, fractures, stresses, etc.) that are building up overtime. An example of such monitoring for a particular area of material isshown in FIGS. 2A and 2B, where local material degradation causes ametallization of smart material and triggering of an appropriate warning(e.g., constituting “smart response”).

In another example, one or more atomic vacancies can be created in thecoating(s) as a result of an application of heat.

In another example, each coating can comprise a film (e.g., grown in alaboratory). In another example, any desired monitored material can becoated (e.g., by film deposition).

In another example, the sensor can be wrapped around a monitoredmaterial (e.g., a cell phone tower leg).

In another example, the coating(s) can prevent (or otherwise inhibit)environmental damage to the substrate (e.g., the coating(s) couldprevent (or otherwise inhibit) oxidation).

In another example, the signal that is based upon the change in thesubstrate can be a quick reaction signal (e.g., the signal can begenerated within a short time span).

Various embodiments can be applied to various tower types (e.g.,Monopole, Lattice, Guyed). Such tower types are typically used fornetwork support and typically have moderately simple designs buttypically require regular monitoring, auditing, and assessment todetermine what kind of damage (if any) has been sustained (such as dueto wear-and-tear or catastrophic impacts). Even considering therelatively simple structure and design of a common cell phone towerthere are a wide variety of problems that arise due to weather, climate,and other external factors. Various embodiments described herein providecertain advantages over conventional monitoring of such towers (suchconventional monitoring typically uses manual audits as well as motionsensors and other basic sensors to monitor basic issues).

Turning now to FIG. 4, there is illustrated a block diagram of acomputing environment in accordance with various aspects describedherein. In order to provide additional context for various embodimentsof the embodiments described herein, FIG. 4 and the following discussionare intended to provide a brief, general description of a suitablecomputing environment 400 in which the various embodiments of thesubject disclosure can be implemented. In one example, implementationcan be via computer-executable instructions that can run on one or morecomputers, and/or in combination with other program modules and/or as acombination of hardware and software. For example, computing environment400 can facilitate in whole or in part manufacturing of a sensor asdescribed herein and/or use of a sensor as described herein.

Generally, program modules comprise routines, programs, components, datastructures, etc., that perform particular tasks or implement particularabstract data types. Moreover, those skilled in the art will appreciatethat the inventive methods can be practiced with other computer systemconfigurations, comprising single-processor or multiprocessor computersystems, minicomputers, mainframe computers, as well as personalcomputers, hand-held computing devices, microprocessor-based orprogrammable consumer electronics, and the like, each of which can beoperatively coupled to one or more associated devices.

As used herein, a processing circuit includes one or more processors aswell as other application specific circuits such as an applicationspecific integrated circuit, digital logic circuit, state machine,programmable gate array or other circuit that processes input signals ordata and that produces output signals or data in response thereto. Itshould be noted that while any functions and features described hereinin association with the operation of a processor could likewise beperformed by a processing circuit.

The illustrated embodiments of the embodiments herein can be alsopracticed in distributed computing environments where certain tasks areperformed by remote processing devices that are linked through acommunications network. In a distributed computing environment, programmodules can be located in both local and remote memory storage devices.

Computing devices typically comprise a variety of media, which cancomprise computer-readable storage media and/or communications media,which two terms are used herein differently from one another as follows.Computer-readable storage media can be any available storage media thatcan be accessed by the computer and comprises both volatile andnonvolatile media, removable and non-removable media. By way of example,and not limitation, computer-readable storage media can be implementedin connection with any method or technology for storage of informationsuch as computer-readable instructions, program modules, structured dataor unstructured data.

Computer-readable storage media can comprise, but are not limited to,random access memory (RAM), read only memory (ROM), electricallyerasable programmable read only memory (EEPROM), flash memory or othermemory technology, compact disk read only memory (CD-ROM), digitalversatile disk (DVD) or other optical disk storage, magnetic cassettes,magnetic tape, magnetic disk storage or other magnetic storage devicesor other tangible and/or non-transitory media which can be used to storedesired information. In this regard, the terms “tangible” or“non-transitory” herein as applied to storage, memory orcomputer-readable media, are to be understood to exclude onlypropagating transitory signals per se as modifiers and do not relinquishrights to all standard storage, memory or computer-readable media thatare not only propagating transitory signals per se.

Computer-readable storage media can be accessed by one or more local orremote computing devices, e.g., via access requests, queries or otherdata retrieval protocols, for a variety of operations with respect tothe information stored by the medium.

Communications media typically embody computer-readable instructions,data structures, program modules or other structured or unstructureddata in a data signal such as a modulated data signal, e.g., a carrierwave or other transport mechanism, and comprises any informationdelivery or transport media. The term “modulated data signal” or signalsrefers to a signal that has one or more of its characteristics set orchanged in such a manner as to encode information in one or moresignals. By way of example, and not limitation, communication mediacomprise wired media, such as a wired network or direct-wiredconnection, and wireless media such as acoustic, RF, infrared and otherwireless media.

With reference again to FIG. 4, the example environment can comprise acomputer 402, the computer 402 comprising a processing unit 404, asystem memory 406 and a system bus 408. The system bus 408 couplessystem components including, but not limited to, the system memory 406to the processing unit 404. The processing unit 404 can be any ofvarious commercially available processors. Dual microprocessors andother multiprocessor architectures can also be employed as theprocessing unit 404.

The system bus 408 can be any of several types of bus structure that canfurther interconnect to a memory bus (with or without a memorycontroller), a peripheral bus, and a local bus using any of a variety ofcommercially available bus architectures. The system memory 406comprises ROM 410 and RAM 412. A basic input/output system (BIOS) can bestored in a non-volatile memory such as ROM, erasable programmable readonly memory (EPROM), EEPROM, which BIOS contains the basic routines thathelp to transfer information between elements within the computer 402,such as during startup. The RAM 412 can also comprise a high-speed RAMsuch as static RAM for caching data.

The computer 402 further comprises an internal hard disk drive (HDD) 414(e.g., EIDE, SATA), which internal HDD 414 can also be configured forexternal use in a suitable chassis (not shown), a magnetic floppy diskdrive (FDD) 416, (e.g., to read from or write to a removable diskette418) and an optical disk drive 420, (e.g., reading a CD-ROM disk 422 or,to read from or write to other high capacity optical media such as theDVD). The HDD 414, magnetic FDD 416 and optical disk drive 420 can beconnected to the system bus 408 by a hard disk drive interface 424, amagnetic disk drive interface 426 and an optical drive interface 428,respectively. The hard disk drive interface 424 for external driveimplementations comprises at least one or both of Universal Serial Bus(USB) and Institute of Electrical and Electronics Engineers (IEEE) 1394interface technologies. Other external drive connection technologies arewithin contemplation of the embodiments described herein.

The drives and their associated computer-readable storage media providenonvolatile storage of data, data structures, computer-executableinstructions, and so forth. For the computer 402, the drives and storagemedia accommodate the storage of any data in a suitable digital format.Although the description of computer-readable storage media above refersto a hard disk drive (HDD), a removable magnetic diskette, and aremovable optical media such as a CD or DVD, it should be appreciated bythose skilled in the art that other types of storage media which arereadable by a computer, such as zip drives, magnetic cassettes, flashmemory cards, cartridges, and the like, can also be used in the exampleoperating environment, and further, that any such storage media cancontain computer-executable instructions for performing the methodsdescribed herein.

A number of program modules can be stored in the drives and RAM 412,comprising an operating system 430, one or more application programs432, other program modules 434 and program data 436. All or portions ofthe operating system, applications, modules, and/or data can also becached in the RAM 412. The systems and methods described herein can beimplemented utilizing various commercially available operating systemsor combinations of operating systems.

A user can enter commands and information into the computer 402 throughone or more wired/wireless input devices, e.g., a keyboard 438 and apointing device, such as a mouse 440. Other input devices (not shown)can comprise a microphone, an infrared (IR) remote control, a joystick,a game pad, a stylus pen, touch screen or the like. These and otherinput devices are often connected to the processing unit 404 through aninput device interface 442 that can be coupled to the system bus 408,but can be connected by other interfaces, such as a parallel port, anIEEE 1394 serial port, a game port, a universal serial bus (USB) port,an IR interface, etc.

A monitor 444 or other type of display device can be also connected tothe system bus 408 via an interface, such as a video adapter 446. Itwill also be appreciated that in alternative embodiments, a monitor 444can also be any display device (e.g., another computer having a display,a smart phone, a tablet computer, etc.) for receiving displayinformation associated with computer 402 via any communication means,including via the Internet and cloud-based networks. In addition to themonitor 444, a computer typically comprises other peripheral outputdevices (not shown), such as speakers, printers, etc.

The computer 402 can operate in a networked environment using logicalconnections via wired and/or wireless communications to one or moreremote computers, such as a remote computer(s) 448. The remotecomputer(s) 448 can be a workstation, a server computer, a router, apersonal computer, portable computer, microprocessor-based entertainmentappliance, a peer device or other common network node, and typicallycomprises many or all of the elements described relative to the computer402, although, for purposes of brevity, only a remote memory/storagedevice 450 is illustrated. The logical connections depicted comprisewired/wireless connectivity to a local area network (LAN) 452 and/orlarger networks, e.g., a wide area network (WAN) 454. Such LAN and WANnetworking environments are commonplace in offices and companies, andfacilitate enterprise-wide computer networks, such as intranets, all ofwhich can connect to a global communications network, e.g., theInternet.

When used in a LAN networking environment, the computer 402 can beconnected to the LAN 452 through a wired and/or wireless communicationnetwork interface or adapter 456. The adapter 456 can facilitate wiredor wireless communication to the LAN 452, which can also comprise awireless AP disposed thereon for communicating with the adapter 456.

When used in a WAN networking environment, the computer 402 can comprisea modem 458 or can be connected to a communications server on the WAN454 or has other means for establishing communications over the WAN 454,such as by way of the Internet. The modem 458, which can be internal orexternal and a wired or wireless device, can be connected to the systembus 408 via the input device interface 442. In a networked environment,program modules depicted relative to the computer 402 or portionsthereof, can be stored in the remote memory/storage device 450. It willbe appreciated that the network connections shown are example and othermeans of establishing a communications link between the computers can beused.

The computer 402 can be operable to communicate with any wirelessdevices or entities operatively disposed in wireless communication,e.g., a printer, scanner, desktop and/or portable computer, portabledata assistant, communications satellite, any piece of equipment orlocation associated with a wirelessly detectable tag (e.g., a kiosk,news stand, restroom), and telephone. This can comprise WirelessFidelity (Wi-Fi) and BLUETOOTH® wireless technologies. Thus, thecommunication can be a predefined structure as with a conventionalnetwork or simply an ad hoc communication between at least two devices.

Wi-Fi can allow connection to the Internet, without wires. Wi-Fi is awireless technology similar to that used in a cell phone that enablessuch devices, e.g., computers, to send and receive data indoors and out;anywhere within the range of a base station. Wi-Fi networks use radiotechnologies called IEEE 802.11 (a, b, g, n, ac, ag, etc.) to providesecure, reliable, fast wireless connectivity. A Wi-Fi network can beused to connect computers to each other, to the Internet, and to wirednetworks (which can use IEEE 802.3 or Ethernet). Wi-Fi networks operatein the unlicensed 2.4 and 5 GHz radio bands for example or with productsthat contain both bands (dual band), so the networks can providereal-world performance similar to the basic 10BaseT wired Ethernetnetworks used in many offices.

The terms “first,” “second,” “third,” and so forth, as used in theclaims, unless otherwise clear by context, is for clarity only anddoesn't otherwise indicate or imply any order in time. For instance, “afirst determination,” “a second determination,” and “a thirddetermination,” does not indicate or imply that the first determinationis to be made before the second determination, or vice versa, etc.

In the subject specification, terms such as “store,” “storage,” “datastore,” data storage,” “database,” and substantially any otherinformation storage component relevant to operation and functionality ofa component, refer to “memory components,” or entities embodied in a“memory” or components comprising the memory. It will be appreciatedthat the memory components described herein can be either volatilememory or nonvolatile memory, or can comprise both volatile andnonvolatile memory, by way of illustration, and not limitation, volatilememory, non-volatile memory, disk storage, and memory storage. Further,nonvolatile memory can be included in read only memory (ROM),programmable ROM (PROM), electrically programmable ROM (EPROM),electrically erasable ROM (EEPROM), or flash memory. Volatile memory cancomprise random access memory (RAM), which acts as external cachememory. By way of illustration and not limitation, RAM is available inmany forms such as synchronous RAM (SRAM), dynamic RAM (DRAM),synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhancedSDRAM (ESDRAM), Synchlink DRAM (SLDRAM), and direct Rambus RAM (DRRAM).Additionally, the disclosed memory components of systems or methodsherein are intended to comprise, without being limited to comprising,these and any other suitable types of memory.

Moreover, it will be noted that the disclosed subject matter can bepracticed with other computer system configurations, comprisingsingle-processor or multiprocessor computer systems, mini-computingdevices, mainframe computers, as well as personal computers, hand-heldcomputing devices (e.g., PDA, phone, smartphone, watch, tabletcomputers, netbook computers, etc.), microprocessor-based orprogrammable consumer or industrial electronics, and the like. Theillustrated aspects can also be practiced in distributed computingenvironments where tasks are performed by remote processing devices thatare linked through a communications network; however, some if not allaspects of the subject disclosure can be practiced on stand-alonecomputers. In a distributed computing environment, program modules canbe located in both local and remote memory storage devices.

Some of the embodiments described herein can also employ artificialintelligence (AI) to facilitate automating one or more featuresdescribed herein. The embodiments (e.g., in connection withautomatically manufacturing a sensor and/or automatically utilizing asensor) can employ various AI-based schemes for carrying out variousembodiments thereof. Moreover, a classifier can be employed to determinea ranking or priority. A classifier is a function that maps an inputattribute vector, x=(x1, x2, x3, x4, . . . , xn), to a confidence thatthe input belongs to a class, that is, f(x)=confidence (class). Suchclassification can employ a probabilistic and/or statistical-basedanalysis (e.g., factoring into the analysis utilities and costs) todetermine or infer an action that a user desires to be automaticallyperformed. A support vector machine (SVM) is an example of a classifierthat can be employed. The SVM operates by finding a hypersurface in thespace of possible inputs, which the hypersurface attempts to split thetriggering criteria from the non-triggering events. Intuitively, thismakes the classification correct for testing data that is near, but notidentical to training data. Other directed and undirected modelclassification approaches comprise, e.g., naïve Bayes, Bayesiannetworks, decision trees, neural networks, fuzzy logic models, andprobabilistic classification models providing different patterns ofindependence can be employed. Classification as used herein also isinclusive of statistical regression that is utilized to develop modelsof priority.

As will be readily appreciated, one or more of the embodiments canemploy classifiers that are explicitly trained (e.g., via a generictraining data) as well as implicitly trained (e.g., via observing userbehavior, operator preferences, historical information, receivingextrinsic information). For example, SVMs can be configured via alearning or training phase within a classifier constructor and featureselection module. Thus, the classifier(s) can be used to automaticallylearn and perform a number of functions, including but not limited toautomatically manufacturing a sensor and/or automatically utilizing asensor, etc.

As used in some contexts in this application, in some embodiments, theterms “component,” “system” and the like are intended to refer to, orcomprise, a computer-related entity or an entity related to anoperational apparatus with one or more specific functionalities, whereinthe entity can be either hardware, a combination of hardware andsoftware, software, or software in execution. As an example, a componentmay be, but is not limited to being, a process running on a processor, aprocessor, an object, an executable, a thread of execution,computer-executable instructions, a program, and/or a computer. By wayof illustration and not limitation, both an application running on aserver and the server can be a component. One or more components mayreside within a process and/or thread of execution and a component maybe localized on one computer and/or distributed between two or morecomputers. In addition, these components can execute from variouscomputer readable media having various data structures stored thereon.The components may communicate via local and/or remote processes such asin accordance with a signal having one or more data packets (e.g., datafrom one component interacting with another component in a local system,distributed system, and/or across a network such as the Internet withother systems via the signal). As another example, a component can be anapparatus with specific functionality provided by mechanical partsoperated by electric or electronic circuitry, which is operated by asoftware or firmware application executed by a processor, wherein theprocessor can be internal or external to the apparatus and executes atleast a part of the software or firmware application. As yet anotherexample, a component can be an apparatus that provides specificfunctionality through electronic components without mechanical parts,the electronic components can comprise a processor therein to executesoftware or firmware that confers at least in part the functionality ofthe electronic components. While various components have beenillustrated as separate components, it will be appreciated that multiplecomponents can be implemented as a single component, or a singlecomponent can be implemented as multiple components, without departingfrom example embodiments.

Further, the various embodiments can be implemented as a method,apparatus or article of manufacture using standard programming and/orengineering techniques to produce software, firmware, hardware or anycombination thereof to control a computer to implement the disclosedsubject matter. The term “article of manufacture” as used herein isintended to encompass a computer program accessible from anycomputer-readable device or computer-readable storage/communicationsmedia. For example, computer readable storage media can include, but arenot limited to, magnetic storage devices (e.g., hard disk, floppy disk,magnetic strips), optical disks (e.g., compact disk (CD), digitalversatile disk (DVD)), smart cards, and flash memory devices (e.g.,card, stick, key drive). Of course, those skilled in the art willrecognize many modifications can be made to this configuration withoutdeparting from the scope or spirit of the various embodiments.

In addition, the words “example” and “exemplary” are used herein to meanserving as an instance or illustration. Any embodiment or designdescribed herein as “example” or “exemplary” is not necessarily to beconstrued as preferred or advantageous over other embodiments ordesigns. Rather, use of the word example or exemplary is intended topresent concepts in a concrete fashion. As used in this application, theterm “or” is intended to mean an inclusive “or” rather than an exclusive“or”. That is, unless specified otherwise or clear from context, “Xemploys A or B” is intended to mean any of the natural inclusivepermutations. That is, if X employs A; X employs B; or X employs both Aand B, then “X employs A or B” is satisfied under any of the foregoinginstances. In addition, the articles “a” and “an” as used in thisapplication and the appended claims should generally be construed tomean “one or more” unless specified otherwise or clear from context tobe directed to a singular form.

As employed herein, the term “processor” can refer to substantially anycomputing processing unit or device comprising, but not limited tocomprising, single-core processors; single-processors with softwaremultithread execution capability; multi-core processors; multi-coreprocessors with software multithread execution capability; multi-coreprocessors with hardware multithread technology; parallel platforms; andparallel platforms with distributed shared memory. Additionally, aprocessor can refer to an integrated circuit, an application specificintegrated circuit (ASIC), a digital signal processor (DSP), a fieldprogrammable gate array (FPGA), a programmable logic controller (PLC), acomplex programmable logic device (CPLD), a discrete gate or transistorlogic, discrete hardware components or any combination thereof designedto perform the functions described herein. Processors can exploitnano-scale architectures such as, but not limited to, molecular andquantum-dot based transistors, switches and gates, in order to optimizespace usage or enhance performance of user equipment. A processor canalso be implemented as a combination of computing processing units.

As used herein, terms such as “data storage,” data storage,” “database,”and substantially any other information storage component relevant tooperation and functionality of a component, refer to “memorycomponents,” or entities embodied in a “memory” or components comprisingthe memory. It will be appreciated that the memory components orcomputer-readable storage media, described herein can be either volatilememory or nonvolatile memory or can include both volatile andnonvolatile memory.

What has been described above includes mere examples of variousembodiments. It is, of course, not possible to describe everyconceivable combination of components or methodologies for purposes ofdescribing these examples, but one of ordinary skill in the art canrecognize that many further combinations and permutations of the presentembodiments are possible. Accordingly, the embodiments disclosed and/orclaimed herein are intended to embrace all such alterations,modifications and variations that fall within the spirit and scope ofthe appended claims. Furthermore, to the extent that the term “includes”is used in either the detailed description or the claims, such term isintended to be inclusive in a manner similar to the term “comprising” as“comprising” is interpreted when employed as a transitional word in aclaim.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with other routines. In this context, “start” indicates thebeginning of the first step presented and may be preceded by otheractivities not specifically shown. Further, the “continue” indicationreflects that the steps presented may be performed multiple times and/ormay be succeeded by other activities not specifically shown. Further,while a flow diagram indicates a particular ordering of steps, otherorderings are likewise possible provided that the principles ofcausality are maintained.

As may also be used herein, the term(s) “operably coupled to”, “coupledto”, and/or “coupling” includes direct coupling between items and/orindirect coupling between items via one or more intervening items. Suchitems and intervening items include, but are not limited to, junctions,communication paths, components, circuit elements, circuits, functionalblocks, and/or devices. As an example of indirect coupling, a signalconveyed from a first item to a second item may be modified by one ormore intervening items by modifying the form, nature or format ofinformation in a signal, while one or more elements of the informationin the signal are nevertheless conveyed in a manner than can berecognized by the second item. In a further example of indirectcoupling, an action in a first item can cause a reaction on the seconditem, as a result of actions and/or reactions in one or more interveningitems.

Although specific embodiments have been illustrated and describedherein, it should be appreciated that any arrangement which achieves thesame or similar purpose may be substituted for the embodiments describedor shown by the subject disclosure. The subject disclosure is intendedto cover any and all adaptations or variations of various embodiments.Combinations of the above embodiments, and other embodiments notspecifically described herein, can be used in the subject disclosure.For instance, one or more features from one or more embodiments can becombined with one or more features of one or more other embodiments. Inone or more embodiments, features that are positively recited can alsobe negatively recited and excluded from the embodiment with or withoutreplacement by another structural and/or functional feature. The stepsor functions described with respect to the embodiments of the subjectdisclosure can be performed in any order. The steps or functionsdescribed with respect to the embodiments of the subject disclosure canbe performed alone or in combination with other steps or functions ofthe subject disclosure, as well as from other embodiments or from othersteps that have not been described in the subject disclosure. Further,more than or less than all of the features described with respect to anembodiment can also be utilized.

What is claimed is:
 1. A method comprising: applying to a substrate afirst two-dimensional layer; and applying to the first two-dimensionallayer a second two-dimensional layer, wherein the first two-dimensionallayer and the second two-dimensional layer form a bi-layer element,wherein the bi-layer element has an axis, wherein there is an initialelectrical resistance across the bi-layer element along the axis, andwherein a first change to the substrate results in a second change tothe bi-layer element such that the initial electrical resistance isreplaced by a lower electrical resistance, wherein the substratecomprises all or a portion of an antenna mount.
 2. The method of claim1, wherein the first two-dimensional layer is applied to the substrateby a first film deposition.
 3. The method of claim 2, wherein the secondtwo-dimensional layer is applied to the first two-dimensional layer by asecond film deposition.
 4. The method of claim 1, wherein: the applyingthe first two-dimensional layer comprises a first anion-poor depositionof the first two-dimensional layer on the substrate, resulting in adeficit of Sulfur (S) atoms in the first two-dimensional layer toproduce first atomic vacancies; and the applying the secondtwo-dimensional layer comprises a second anion-poor deposition of thesecond two-dimensional layer on the first two-dimensional layer,resulting in a deficit of Selenium (Se) atoms in the secondtwo-dimensional layer to produce second atomic vacancies.
 5. The methodof claim 4, wherein: the first two-dimensional layer is MolybdenumDisulfide (MoS2); and the second two-dimensional layer is MolybdenumDiselenide (MoSe2).
 6. The method of claim 1, further comprisingdetecting, by a processing system including a processor, presence of thelower electrical resistance across the bi-layer element.
 7. The methodof claim 1, wherein the first change to the substrate comprises amechanical change, and wherein the substrate comprises part of a cellphone tower.
 8. The method of claim 7, wherein the mechanical changecomprises a crack.
 9. The method of claim 1, wherein the first change tothe substrate is caused by mechanical stress, a temperature change, ahumidity change, a change in incident light, or any combinationsthereof.
 10. The method of claim 1, wherein the second change to thebi-layer element comprises migration of first atoms from the firsttwo-dimensional layer to produce first atomic vacancies, migration ofsecond atoms from the second two-dimensional layer to produce secondadditional atomic vacancies, or any combination thereof.
 11. The methodof claim 1, wherein the antenna mount comprises all or a portion of acell phone.
 12. A sensor comprising: a first two-dimensional coatingapplied to a substrate; and a second two-dimensional coating applied tothe first two-dimensional coating, wherein there is a first value of anelectrical property across the sensor from a first side of the sensor toa second side of the sensor, wherein a change to the substrate resultsin a creation of atomic vacancies at an interface between the firsttwo-dimensional coating and the second two-dimensional coating, andwherein the creation of the atomic vacancies changes the first value ofthe electrical property across the sensor to a different electricalproperty, wherein the substrate comprises all or a portion of an antennamount.
 13. The sensor of claim 12, further comprising circuitryconfigured to detect a presence of a lower electrical resistance,wherein the electrical property comprises an electrical resistance, andwherein the creation of the atomic vacancies changes a first value ofthe electrical resistance across the sensor to the lower electricalresistance.
 14. The sensor of claim 13, wherein the circuitry comprisesa first electrical contact on the first side of the sensor, a secondelectrical contact on the second side of the sensor, and a measurementdevice in operative communication with the first electrical contact andthe second electrical contact, and wherein the measurement device isconfigured to measure electrical resistance.
 15. The sensor of claim 12,wherein the first two-dimensional coating is applied to the substrate bya first film deposition and wherein the second two-dimensional coatingis applied to the first two-dimensional coating by a second filmdeposition.
 16. The sensor of claim 15, wherein: the firsttwo-dimensional coating is Molybdenum Disulfide (MoS2); and the secondtwo-dimensional coating is Molybdenum Diselenide (MoSe2).
 17. A devicecomprising: a first two-dimensional layer applied to a substrate,wherein the substrate comprises all or a portion of an antenna mount; asecond two-dimensional layer applied to the first two-dimensional layer,wherein the first two-dimensional layer and the second two-dimensionallayer form a bi-layer element, wherein there is a starting value of aphysical property across the bi-layer element, wherein a physical changeto the bi-layer element results in a creation of atomic vacancies at aninterface between the first two-dimensional layer and the secondtwo-dimensional layer, and wherein the creation of the atomic vacanciesalters the starting value of the physical property to a different value;a processing system including a processor; and a memory that storesexecutable instructions that, when executed by the processing system,facilitate performance of operations, the operations comprising:detecting that the starting value of the physical property has beenaltered.
 18. The device of claim 17, wherein the starting value of thephysical property comprises a starting electrical resistance, whereinthe detecting that the starting value of the physical property has beenaltered to a different value comprises detecting that the startingelectrical resistance has been reduced to a lower value.
 19. The deviceof claim 18, wherein the operations further comprise: outputting asignal, wherein the signal is output responsive to the detecting thatthe starting electrical resistance has been reduced, and wherein thesignal is a visual signal, an audio signal or any combinations thereof.20. The device of claim 19, wherein: in a first case, the firsttwo-dimensional layer is Molybdenum Disulfide (MoS2), the MolybdenumDisulfide (MoS2) is applied to the substrate by a first film deposition,the second two-dimensional layer is Molybdenum Diselenide (MoSe2), andthe Molybdenum Diselenide (MoSe2) is applied to the firsttwo-dimensional layer by a second film deposition; or in a second case,the first two-dimensional layer is Molybdenum Diselenide (MoSe2), theMolybdenum Diselenide (MoSe2) is applied to the substrate by a thirdfilm deposition, the second two-dimensional layer is MolybdenumDisulfide (MoS2) and the Molybdenum Disulfide (MoS2) is applied to thefirst two-dimensional layer by a fourth film deposition.